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Status | Active |
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Category | PCB Headers |
Series | 55959 |
Application | Signal, Wire-to-Board |
Overview | MicroClasp Wire-to-Board System |
Product Name | MicroClasp |
UPC | 756054218327 |
Breakaway | No |
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Circuits (Loaded) | 8 |
Circuits (maximum) | 8 |
Color - Resin | Natural |
Durability (mating cycles max) | 30 |
First Mate / Last Break | No |
Glow-Wire Capable | No |
Guide to Mating Part | No |
Keying to Mating Part | None |
Lock to Mating Part | Yes |
Material - Plating Mating | Tin |
Material - Plating Termination | Tin |
Material - Resin | Polyester |
Net Weight | 1278.700/mg |
Number of Rows | 2 |
Orientation | Right Angle |
PC Tail Length | 3.20mm |
PCB Locator | No |
PCB Retention | Yes |
PCB Thickness - Recommended | 1.60mm |
Packaging Type | Tray |
Pitch - Mating Interface | 2.00mm |
Shrouded | Fully |
Stackable | No |
Surface Mount Compatible (SMC) | No |
Temperature Range - Operating | -25°C to +85°C |
Termination Interface: Style | Through Hole |
(Please review the Product Specification for specific details.) | |
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Current - Maximum per Contact | 3.0A |
Voltage - Maximum | 250V |
Please find UL Certificates by searching the UL Database using the Molex Series Number. Click here to visit the UL Database | |
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UL | E29179 |
Packaging Specification | SPK-55959-001-001 |
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Product Specification | PS-51353-003-001, PS-51353-010-001 |
Sales Drawing | SD-55959-001, SD-55959-003 |
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